Advanced Cooling Solutions for Microcomputers
As computing power continues to increase, so do the challenges that come with it.
Compact system sizes, rising heat dissipation, and demanding environmental conditions require innovative and reliable cooling concepts. To address these challenges, we have got you covered with a range of advanced cooling solutions for microcomputers – designed to balance performance, scalability, and robustness.
Liquid Cooling – Maximum Performance Approach
The liquid cooling solution represents the highest level of thermal efficiency in a compact form factor. Thanks to the low installation height and the interchangeability of standard 19″ modules, the system remains scalable and thus flexible.
All essential components are fully integrated into a compact design which includes the direct heat absorption at the CPU, the heat transport and dissipation and the pump, expansion tank and radiator.
Ideally suited for space-constrained, high-performance applications the liquid cooling enables maximum cooling capacity in the given space.
Forced Air – The Proven Technology for Existing Applications
Classic Cooling Solutions continue to be used successfully in existing projects. Especially in air-cooled environments, it enhances current applications by improving CPU thermal performance. It also supports different processor types, performance classes and TDP ranges. Through thermal simulations, material selection and geometric refinement this cooling solution is optimized by thermal simulations.
This solution is an excellent choice for improving the thermal efficiency of existing systems without major architectural changes.
Conduction Cooled – Cooling with Clamshell
The clamshell cooling concept meets the requirements that must be fulfilled wherever airflow is not permitted or possible. It is based on the Conduction Cooled Assemblies (CCA) concept and fully integrated into the cPCI Serial Standard.
This technology is particularly suitable for application with harsh environmental requirements, such as the Mining, Medical or Defense sector. By eliminating the need for air circulation, clamshell cooling ensures maximum reliability in sealed, dusty or sensitive environments.
More about Embedded World
The Embedded World Exhibition & Conference unites the global embedded community each year in Nuremberg, offering a comprehensive overview of the latest advancements in this dynamic industry. This world is diverse and encompass everything from hardware and software to service and tools.
Get your free ticket now and join us from March 10-12, 2026, for a collaborative exchange and to explore the cutting-edge innovations shaping the future of embedded systems.
Meet the team
The EKF team is available for you at the booth during the entire trade fair and looks forward to your visit. The following employees will be on site at the show.

Manuel Murer
available from Tuesday to Thursday

Alexander Huesmann
available from Tuesday to Thursday

Bernd Kleeberg
available Wednesday and Thursday

Wolfgang Wiest
available from Tuesday to Wednesday

Hannah Stoll
available from Tuesday to Thursday

Markus von Arx
available Tuesday and Wednesday
Besides the EKF team, our partner company Ci4Rail will also be represented at our stand.

Mathias Beer
available from Tuesday to Thursday
Take the opportunity today to make an appointment with one of our employees for a personal meeting.
What else you can expect at the booth
Our AI-Solutions
Out latest CPU’s
Discover our latest CPU modules from the CompactPCI and CompactPCI Serial ranges.
In particular, we will also be presenting our latest CPU card, the SCA-THUNDER.
Meet our partner Ci4Rail
Our partner Ci4Rail will also be present at our booth. Don’t miss the chance to meet them.
More about Ci4Rail




















