EKF - Short Profile
EKF - Short Profile
PC7-FESTIVAL

CompactPCI® PlusIO CPU Card

Intel® XEON® E3 v6 Family Processor
PC7-FESTIVAL

Description

Ordering Information

Product Information

Block Diagram

Hybrid Backplane

User Guide

Application Notes
Power Event (Power Down)

General Information
PlusIO

Low Profile Mezzanine Modules
C48
Mezzanine Side Cards
PCU

PC7-FESTIVAL

Firmware

Update

Drivers

Graphics | Ethernet | SATA

Photo Gallery

1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 12 | 14

Low Profile Mezzanine Modules

1 | 2

Option M12 Gigabit Ethernet

1 | 2

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PC7-FESTIVAL

CompactPCI® PlusIO CPU Card

Intel® XEON® E3 v6 Processor


The PC7-FESTIVAL is a rich featured high performance 4HP/3U CompactPCI® PlusIO CPU board, equipped with an Intel® Xeon® E3 familiy mobile workstation processor for demanding applications. For scalability, the PC7-FESTIVAL is also available with a 7th Generation Intel® CoreT processor.

The PC7-FESTIVAL front panel is provided with two RJ45 Gigabit Ethernet jacks, two USB 3.0 Type-A receptacles, and two DisplayPort™ connectors. In addition, a third USB Type-C front panel receptacle i available as an option, usable alternatively as (third) DisplayPort.

The powerful Xeon® E3-1500 v6 series processor is accompanied by the CM238 mobile PCH, for a maximum of high speed I/O resources (e.g. PCI Express®, SATA, USB).


On-board mass-storage solutions are based on low profile mezzanine expansion cards, which can accommodate up to two M.2 style SSD modules (PCIe® Gen3 x4 and/or SATA 6G). Side cards for an 8HP assembly are also available, providing front I/O and M.2 SSDs.

The PC7-FESTIVAL is equipped with up to 32GB DDR4 RAM with ECC support. Up to 16GB memory-down are provided for rugged applications, and another 16GB are available via the DDR4 ECC SO-DIMM socket.

The backplane connector J1 allows for up to seven CompactPCI® Classic peripheral cards in a system. The J2 connector complies with the CompactPCI® PlusIO standard for high speed rear I/O (fourfold PCIe®, SATA and USB2), or a hybrid CompactPCI® Serial backplane.


PC7-FESTIVAL

PC7-FESTIVAL • Low Power CPU Board

Feature Summary

General
  • CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
  • Backplane communication via CompactPCI® J1 and J2 hard metric connectors
  • J1 Connector for PICMG® CompactPCI® 32-Bit Support
  • J2 Connector for CompactPCI® PlusIO support (PCIe®, SATA, USB2)
  • J2 PlusIO configuration allows for either CompactPCI® Serial backplane usage or rear I/O module attachment
  • J2 Connector option available for 64-bit system slot (legacy CompactPCI® 2.0 Classic)
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

Power Supply
  • +5V, +3.3V according to CompactPCI® 2.0 via J1 backplane connector
  • Total power consumption depends on processor type and mezzanine assembly
  • Option +5V only board design for low cost system power supply with 25W processors
  • SAC (Stand-Alone Computer) option w. two-pos. 5V/10A terminal block (J1/J2 removed)
  • +12V is required additionally for PC7-FESTIVAL mezzanine assemblies with S20, S40, SCL, SCZ

Processor
  • Intel® Kaby Lake-H mobile platform with ECC (CM238 mobile workstation PCH)
  • Intel® Xeon® processor E3 v6 family (mobile workstation)
  • Xeon E3 1505M v6 • 3/4GHz • 8M • 4C/8T • DDR4 2400 ECC • 45/35W • GT2 - P630 • vPRO™/AMT
  • Xeon E3 1505L v6 • 2.2/3GHz • 8M • 4C/8T • DDR4 2400 ECC • 25W • GT2 - P630 • vPRO™/AMT
  • 7th Generation Intel® Core™ mobile processor
  • i3 7100E • 2.9GHz • 3M • 2C/4T • DDR4 2400 ECC • 35W • GT2 - 630
  • i3 7102E • 2.1GHz • 3M • 2C/4T • DDR4 2400 ECC • 25W • GT2 -630

Firmware
  • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
  • Fully customizable by EKF
  • Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
  • Windows®, Linux and other (RT)OS' supported
  • Intel® AMT supported for Intel® Xeon® E3 v6 (disabled by default, must be enabled via BIOS setup)
* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

Main Memory
  • Integrated memory controller up to up to 32GB DDR4 2400 +ECC
  • DDR4 +ECC soldered memory up to 16GB
  • DDR4 +ECC SO-DIMM memory module socket up to 16GB

Mezzanine Mass Storage
  • Mezzanine side card connectors for local expansion e.g. SSD mass storage
  • Low profile mezzanine modules available (4HP common front panel)
  • Side cards available (8HP common F/P assembly)
  • P-HSE1 - configurable as 4 x SATA 6G or 4 x PCIe® Gen3 (from CM238 PCH), 1 x USB3
  • P-HSE2 - 4 x PCIe® Gen3 (from CM238 PCH) & 3rd DisplayPort™ (from CPU)
  • P-EXP - Legacy interface (from PCH)
  • 4HP Low profile mezzanine module preferred options:
  • C48-M2 Mezzanine module - 2 x M.2 2280 SATA SSD sockets
  • S48-SSD - 1 x M.2 2280 NVMe® SSD socket, 1 x M.2 2280 NVMe® or SATA SSD socket (autosense), 1 x Type-C USB F/P connector (enabled for DisplayPort alternate mode)
  • 8HP/12HP Mezzanine side card options:
  • P01-M12 Replacement for RJ45 GbE jacks by M12-X receptacles
  • PCU-UPTEMPO - Side board w. 2 x M.2 SATA SSD sockets & front I/O
  • PCZ-NVM - Side board w. 2 x M.2 NVMe® SSD sockets & front I/O
  • SCJ-VEENA - 1 x M.2 NVMe® or SATA SSD socket (autosense), quad 2.5GBASE-T Ethernet RJ45 jacks
  • Custom specific side card design - I/O and storage

Graphics
  • Integrated graphics engine, 3 symmetric independent displays
  • 3D HW acceleration DirectX12, OpenCL 2.x, OpenGL 4.3/4.4, ES 2.0
  • HW video decode/encode HEVC10b 10-bit, VP9 10-bit, JPEG
  • HDR (High Dynamic Range) Rec. 2020 Wide Color Gamut
  • Content protection
  • UHD premium content playback
  • Front panel options: Dual DisplayPort™ (DP) connectors
  • 3rd DisplayPort™ optional via Type-C connector on low profile mezzanine card S48-SSD
  • Max resolution 4096 x 2304 @60Hz (any DisplayPort, concurrent operation)
  • DisplayPort™ 1.2 Multi-Stream Transport (MST) - display daisy chaining
  • MST max resolution via single DP connector 2880x1800@60Hz (2 displays), 2304x1440@60Hz (3 displays)
  • Integrated audio (3 independent audio streams)

Networking
  • Up to four networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
  • Port 1 equipped w. I219LM PHY (suitable for Intel® AMT)
  • Port 2 equipped w. Intel® I210-IT -40°C to +85°C operating temperature GbE controller w. integrated PHY
  • IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
  • IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
  • IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
  • RJ45 front panel jacks (option 2 x M12-X with mezzanine module P01)
  • Option front panel M12 X-coded GbE ports with SCL-RHYTHM side card (8HP front panel width)
  • Option quad 2.5GbE RJ45 front panel ports with SCJ-VEENA side card (8HP front panel width)

Chipset
  • Intel® CM238 Mobile Workstation Platform Controller Hub (PCH)
  • PCIe® Gen3 8GT/s
  • SATA 6G
  • USB3
  • GbE
  • SPI, LPC, Audio, Legacy

On-Board Building Blocks
  • Additional on-board controllers, PCIe® based
  • PCIe® to PCI® Bridge 32bit 33/66MHz for 7 CompactPCI®Classic peripheral card backplane slots
  • 1 x Gigabit Ethernet controllers Intel® I210IT (front panel)
  • 1 x Gigabit Ethernet PHY Intel® I219LM (front I/O)
  • IEEE 1588-2008 Precision Time Protocol including PPS and PPM signals supported

Security
  • Trusted Platform Module (option)
  • Discrete TPM 2.0 for highest level of certified platform protection
  • Infineon Optiga™ SLM 9670 cryptographic processor
  • Conforming to TCG 2.0 specification
  • Option fTPM (firmware-based TPM 2.0) or dTPM (discrete TPM) selectable from UEFI (BIOS) setup
  • AES hardware acceleration support (Intel® AES-NI)

Front Panel I/O (4HP)
  • 2 x Gigabit Ethernet RJ45 (1 = PCH & I219LM - Intel® AMT support, 2 = I210IT)
  • 2 x DisplayPort™ (from processor integrated HD graphics engine, standard DP latching receptacles)
  • 2 x USB 3.0 Type-A
  • Option Type-C USB 3.1 Gen1 w. S48-SSD low profile mezzanine module
  • Support for Type-C locking plugs (dual screw) according to the 'Locking Connector Spec. Rev. 1.0'
  • DisplayPort™ Alt Mode on Type-C connector (3rd video monitor output)

Additional Front I/O (8HP)
  • Option RS-232, USB3, DisplayPort™ w. PCZ-NVM side card
  • Option quad port 2.5GbE RJ45 jacks w. SCJ-VEENA side card
  • Option 2 x M12 X-coded receptacles for Gigabit Ethernet (P01, as replacement for RJ45)
  • Option RS-232, HD-Audio, USB w. PCU-UPTEMPO side card
  • Custom specific front panel and side card design

CompactPCI® Backplane Resources
  • PICMG® CompactPCI® 2.0 CPU card & system slot controller for J1 based 32-bit CompactPCI® systems
  • Support for up to seven CompactPCI® peripheral boards, 33/66MHz (PI7C9X112 PCIe® to PCI® bridge)
  • PICMG® CompactPCI® 2.30 J2 connector pin assignment according to CompactPCI® PlusIO
  • J2 is assigned to 4 x PCIe® Gen2*, 4 x SATA 3G*, and 4 x USB2 ports (all derived from PCH)
  • J2 can be used to enable CompactPCI® Serial peripheral card slots for hybrid systems with a split backplane
  • Hybrid small system racks available (e.g. SRP-BLUBOXX)
  • J2 can be used alternatively for a rear I/O module
  • Custom specific rear I/O module design on request
  • J2 Connector option available - 64-bit system slot tolerant for legacy CompactPCI® 2.0 (Classic)
* CompactPCI® PlusIO specifies PCIe® 5GT/s and SATA 3G over J2

Environmental & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant 2002/95/EC
  • EC Regulatory EN55024, EN55032, EN62368-1
  • Operating temperature 0°C to +70°C
  • Operating temperature -40°C to +850°C (industrial temperature range) on request
  • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
  • Humidity 5% ... 95% RH non Condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF 21.2 years

Applications
  • General industrial computing, ready for x86 based software
  • IIoT applications, edge computing, IIOT
  • Medium to high embedded CPU performance
  • CompactPCI® Classic systems upgrade
  • CompactPCI® Serial peripheral card expansion
  • Stand-Alone Computer (SAC)

PC7-FESTIVAL • Simplified Block Diagram

PC7-FESTIVAL • Simplified Block Diagram
Ordering Information
Please refer to List 21 for popular SKUs