PC6-TANGO

CompactPCI® PlusIO CPU Card • Low Power Consumption Intel® Atom™ SoC (Apollo Lake APL-I E39xx)

The PC6-TANGO is a low power 4HP/3U CompactPCI® PlusIO CPU board, equipped with an Intel® Atom® 39xx-series System-on-Chip processor (Apollo Lake). The PC6-TANGO front panel is provided with two Gigabit Ethernet jacks (option M12-X), two USB 3.0 receptacles, two DisplayPort connectors, and optionally a Micro SD Card slot.
The PC6-TANGO is equipped with 8GB directly soldered DDR3L ECC RAM, and a CFast™ card socket as on-board SSD mass storage solution. Optionally available is an on-board 64GByte e•MMC flash memory chip. Further more, low profile SATA SSD mezzanine modules are available as additional on-board mass storage solution. The PC6-TANGO backplane connectors comply with the CompactPCI® PlusIO specification, suitable for system expansion with classic CompactPCI® peripheral cards via J1, and in addition a rear I/O module attached to J2, or up to four CompactPCI® Serial cards accessed on a hybrid backplane.

Downloads & Resources

Documents

Application Notes

Power Event (Power Down)

Firmware

Firmware Update

Release Notes

Drivers

Tools

Technical Library

Ordering Information

PC6-280D-TANGO	3U/4HP Atom(TM) x5-E3930 1.30GHz DC 6.5W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.30 PlusIO: 4xUSB2, 1xSATA3G, 4xPCIe, 2xGbE
PC6-286D-TANGO	3U/4HP Atom(TM) x5-E3930 1.30GHz DC 6.5W TDP, 2MB L2 4GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.0 CompactPCI64
PC6-480D-TANGO	3U/4HP Atom(TM) x5-E3940 1.60GHz QC 9.5W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.30 PlusIO: 4xUSB2, 1xSATA3G, 4xPCIe, 2xGbE
PC6-486D-TANGO	3U/4HP Atom(TM) x5-E3940 1.60GHz QC 9.5W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.0 CompactPCI64
PC6-680D-TANGO	3U/4HP Atom(TM) x7-E3950 1.60GHz QC 12W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.30 PlusIO: 4xUSB2, 1xSATA3G, 4xPCIe, 2xGbE
PC6-686D-TANGO	3U/4HP Atom(TM) x7-E3950 1.60GHz QC 12W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; PICMG 2.0 CompactPCI64
PC6-C60D-TANGO	3U/4HP Atom(TM) x5-E3930 1.30GHz DC 6.5W TDP, 2MB L2 8GB on-board DDR3L+ECC, 2xDP, 2xUSB3, 2xGbE Local Exp.: 2xUSB, 2xSATA6G, CFast; incl PCU-P300; incl modification PCU-P300 with J2

Expansion Modules

Low Profile Mezzanine Modules

C41

C44

C45

C48

Side Cards

PCU

Specifications

General

CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
Form factor single size Eurocard (board dimensions 100x160mm²)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
Backplane communication via CompactPCI® J1 and J2 hard metric connectors
J1 Connector for PICMG® CompactPCI® 32-Bit Support
J2 Connector for CompactPCI® PlusIO support (PCIe, SATA, USB2, GbE)
J2 PlusIO configuration allows for either CompactPCI® Serial backplane usage or rear I/O module attachment
On-board 2 x SATA 6G mezzanine expansion option for mass storage modules or side cards
Side cards and low profile mass storage modules available as COTS and also as custom specific
+5V only board design for low cost system power supply
PC6-TANGO can deliver +3.3V to CompactPCI® peripheral boards

Processor

Intel® Apollo Lake (APL-I) SoC E39xx Series
x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
Graphics Burst, CPU Burst, Intel® Speedstep®
Intel® Virtualization Technology (Intel® VT-x / VT-d)
Intel® Trusted Execution Engine (Intel® TXE) 3.0

Firmware

Main Memory

Mass Storage

On-board CFast™ Card socket (SATA based CompactFlash)
Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
SPI Flash 128Mbit (UEFI firmware and customer application data)
Option e•MMC (embedded MMC 5.0 64GByte soldered)
Option low profile mezzanine card C41-CFAST (secondary CFast™ card socket) via P-HSE connector
Option low profile mezzanine card C42-SATA (1.8-inch Micro SATA SSD socket) via P-HSE connector
Option low profile mezzanine card C48-M2 (dual M.2 SATA SSD module sockets) via P-HSE connector
Option 8HP assembly side card PCU-UPTEMPO (dual M.2 SATA SSD module sockets) via P-HSE connector
Option 8HP assembly side card C44-SATA (2.5-inch SATA SSD/HDD) via P-HSE connector
Option custom specific mezzanine board design on request

Graphics

Networking

Up to four networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
Two GbE ports via RJ45 front panel jacks (option 2 x M12-X with mezzanine module P01)
Option two GbE ports via backplane connector

APL SoC I/O Usage

4 x PCIe Gen2 to J2 backplane connector – usage for CompactPCI® Serial peripheral cards or rear I/O module
1 x PCIe Gen2 to PCIe switch PI7C9X2G606PR 1:5 lanes (on-board PCIe devices)
1 x PCIe to PI7C9X112 PCI bridge (J1 backplane connector, for classic CompactPCI® card support)
1 x SATA 6G to on-board CFast™ SSD card socket – can be used as mass storage and boot device
1 x SATA 6G to mezzanine expansion connector P-HSE
e•MMC I/F 400MByte/s (HS400) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
2 x USB 3.0 to front panel connectors
2 x DisplayPort to front panel connectors
SDIO (Micro SD Card) front panel slot (option, available on request)
4 x USB2 to J2 backplane connector
LPC, Audio, I2C, 2 x USB2 to mezzanine expansion connector P-EXP
Option LPC to TPM 2.0 module

On-Board Building Blocks

Additional on-board controllers, PCIe® based
PCIe® Gen2 packet switch PI7C9X2G606PR (6-port, 6-lane)
2 x Gigabit Ethernet controllers Intel® I210IT (front panel)
Option 2 x Intel® I210IT (RIO via J2 backplane connector)
PCIe® to PCI® bridge PI7C9X112 (7 x PCI 33/66MHz)
PCIe® Gen2 packet switch PLX 8608
Option dual port SATA 6G/3G* controller Marvell® 88SE9170 (to P-HSE mezzanine connector, and J2 RIO)
Option e•MMC (embedded MMC 5.0 64GByte HS400)

Security

Front Panel I/O (4HP)

Front Panel I/O (8HP)

CompactPCI® & CompactPCI® Plus I/O Backplane Resources

PICMG® CompactPCI® 2.0 CPU card & system slot controller for J1 based 32-bit CompactPCI® systems
Support for up to seven CompactPCI® peripheral boards, 33/66MHz (PI7C9X112 PCIe to PCI bridge)
PICMG® CompactPCI® 2.30 J2 connector pin assignment according to CompactPCI® PlusIO **
J2 can be used to enable CompactPCI® Serial peripheral card slots for hybrid systems with a split backplane
J2 can be used alternatively for a rear I/O module
J2 is assigned to 4 x PCIe Gen2 5GT/s (from APL SoC), 1 x SATA 6G/3G * (from Marvell SATA controller), 4 x USB2 ports (from APL SoC), 2 x Gigabit Ethernet (I210IT networking controllers)

* CompactPCI® PlusIO specifies SATA 3G over J2. SATA 6G may be functional but is not guaranteed. The Marvell SATA controller port available via J2 is therefore configured for 3Gbps by default.
** In case of obsolescence, the J2 UHM connector will be replaced by the CompactPCI® 2.0 classic J2 connector. This may reduce high speed backplane transfer in particular applications (PCIe Gen1 2.5GT/s, SATA 1.5G). This does not affect peripherals attached via the P-HSE mezzanine connector.

Local Expansion

Mezzanine side card connectors for optional local expansion
P-EXP – LPC, Audio, 2 x USB2, I2C (from APL SoC)
P-HSE – 2 x SATA 6G (port 1 from APL SoC, port 2 from optional PCIe to SATA controller 88SE9170)
4HP Low profile mezzanine module options (to be ordered separately)
CFast™ Card with C41-CFAST mezzanine module
SATA 1.8-Inch Solid State Drive with C42-SATA mezzanine module
Dual M.2/NGFF SATA SSD 2230 – 2280 size with C48-M2 mezzanine module
Custom specific module design
8HP Mezzanine side card option (to be ordered separately)
PCU-UPTEMPO side board w. 2 x M.2 SATA sockets & front I/O
2.5-inch SATA SSD/HDD available with C44-SATA
Custom specific side card design

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant 2002/95/EC
EC Regulatory EN55024, EN55032, EN62368-1
Operating temperature -40°C to +85°C (industrial temperature range)
Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
Humidity 5% … 95% RH non Condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 21.6 years

RT OS Board Support Packages & Driver

Applications

Simplified Block Diagram

Product Lifecycle

In Development
This product is currently under development and not yet available.
Active Product
This product is available for purchase and actively supported.
NRFND
"Not Recommended for New Designs" – we suggest avoiding this product for new projects.
EOL
"End of Life" – this product is discontinued and no longer available.

PC6-TANGO

CompactPCI® PlusIO CPU Card • Low Power Consumption Intel® Atom™ SoC (Apollo Lake APL-I E39xx)

EKF Elektronik GmbH

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EKF

EKF

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PC6-TANGO

CompactPCI® PlusIO CPU Card • Low Power Consumption Intel® Atom™ SoC (Apollo Lake APL-I E39xx)

EKF Elektronik GmbH

Products

Industries

EKF

EKF

Social Media

Release Notes for Phoenix UEFI/BIOS Firmware on EKF PC6-TANGO

2024-07-03: UEFI/BIOS production release, Build #160

2024-01-09: UEFI/BIOS production release, Build #154

2023-09-29: UEFI/BIOS production release, Build #152

2023-09-22: UEFI/BIOS production release, Build #150

2023-07-07: UEFI/BIOS production release, Build #146

2022-11-02: UEFI/BIOS production release, Build #144

2020-10-09: UEFI/BIOS production release, Build #142

2020-08-11: UEFI/BIOS production release, Build #140

2020-01-28: UEFI/BIOS production release, Build 130

2019-10-30: UEFI/BIOS production release, Build 120

2019-05-24: UEFI/BIOS production release, Build #100

2019-02-01: UEFI/BIOS production release, Build #050

2018-11-23: UEFI/BIOS production release, Build #040

2018-10-08: UEFI/BIOS production release, Build #034

2018-04-30: First UEFI/BIOS production release, Build #028