PC9-TOCCATA

CompactPCI® PlusIO Card • Intel® XEON® W 11xxx (Tiger Lake)

The PC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® PlusIO CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.

The PC9-TOCCATA front panel is provided with three 2.5Gbps Ethernet jacks for networking and three 10Gbps USB Type-C receptacles (DisplayPort Alternate Mode enabled) for versatile device and display attachment.

On-board mass-storage solutions are based on low profile mezzanine expansion cards, which accommodate M.2 style PCIe® SSD modules.

The PC9-TOCCATA is equipped with up to 64GB DDR4 ECC RAM. 32GB memory-down are provided for rugged applications, and another 32GB are available via the DDR4 ECC SODIMM socket.

The XEON® and Core™ processors are accompanied by the RM590E mobile PCH, for a maximum of high speed I/O resources (e.g. PCI Express®, SATA, USB). The PC9-TOCCATA backplane connectors comply with the CompactPCI® PlusIO specification, suitable for system expansion with classic CompactPCI® peripheral cards via J1, and in addition high speed I/O such as PCI Express® and 2.5GBASE-T across J2.

Downloads & Resources

Documents

Application Notes

Power Event (Power Down)

Firmware

Firmware Update

Release Notes

Drivers

Expansion Modules

Low Profile Mezzanine Modules

S43

S48

P82

8HP Mezzanine Modules

S02

Side Cards

SCL

SCJ

SCY

PCZ

Specifications

General

PICMG® CompactPCI® PlusIO (PICMG® CPCI 2.30) CPU card
Form factor single size Eurocard (board dimensions 100x160mm2)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional full height mezzanine side card)
Front panel I/O connectors for typical system configuration
3 x 10Gbps USB Type-C DP Alt Mode, 3 x 2.5Gbps Ethernet RJ45
Backplane communication via CompactPCI® PlusIO connectors
J1 – PCI® 32bit 66MHz (PICMG® CPCI 2.0)
J2 – PCIe®, GbE, SATA, USB (PICMG® CPCI 2.30)
On-board PCIe® mezzanine expansion option for mass storage modules or side cards
Side cards and low profile mass storage modules available as COTS and also as custom specific

Power Requirements

Processor Characteristics

Intel® 11th Generation Mobile XEON® W or Core™ processor
Tiger Lake H45 platform
Up to 8-core, up to 3MB cache per core
DDR4 3200 ECC RAM
Gen 12 graphics, 4 displays up to 8k60
TCC/TSN
Extended temperature operation (CPU junction temperature range T_j up to -40°C to +100°C)
Embedded & industrial use conditions
45/35W configurable TDP, 25W TDP
BGA soldered for optimum reliability
Mobile Intel® Series 500 PCH (RM590E IOTG)

Intel® Xeon® W processors (Industrial Use Case *)
Up to 8 cores, 24MB cache, 32EU, Intel® vPro™ eligible
W-11865MRE | 8c 24M | 4.7GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j -40° C to +100° C | SC9-650D-TOCCATA
W-11555MRE | 6c 12M | 4.5GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j -40° C to +100° C
W-11155MRE | 4c 8M | 4.4GHz Turbo | 2.4GHz Base | 45/35W | 16EU 1250MHz | ECC | TCC/TSN | T_j -40° C to +100° C
W-11865MLE | 8c 24M | 4.5GHz Turbo | 1.5GHz Base | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j 0° C to +100° C | SC9-440D-TOCCATA
W-11555MLE | 6c 12M | 4.4GHz Turbo | 1.9GHz Base | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j 0° C to +100° C
W-11155MLE | 4c 8M | 3.1GHz Turbo | 1.8GHz Base | 25W | 16EU 1250MHz | ECC | TCC/TSN | T_j 0° C to +100° C | SC9-340D-TOCCATA

* disable core/graphics turbo for industrial use condition

Intel® Core™ processors (Embedded Use Case)
i7-11850HE | 8c 24M | 4.7GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | VPro | T_j 0° C to +100° C
i5-11500HE | 6c 12M | 4.5GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | VPro | T_j 0° C to +100° C
i3-11100HE | 4c 8M | 4.4GHz Turbo | 2.4GHz Base | 45/35W | 16EU 1250MHz | T_j 0° C to +100° C
6600HE | 2c 8M | 2.6GHz | 35W | 16EU 1100MHz | T_j 0° C to +100° C | SC9-140D-TOCCATA
6600HLE | 2c 8M | 2.1GHz | 25W | 16EU 1100MHz | T_j 0° C to +100° C

AI (Artificial Intelligence) Resources

DL Boost – set of instructions to accelerate AI workloads
AVX512 – Advanced Vector Extensions & VNNI – Vector Neural Network Instructions – X86 instruction set which is designed to accelerate convolutional neural network for INT8 inference, helps accelerate workloads like image recognition
GNA – Gaussian & Neural Accelerator – a low-power neural coprocessor for continuous inference at the edge, designated for offloading workloads including but not limited to noise reduction or speech recognition, saves power and frees CPU resources
Intel® OpenVINO™ (Open Visual Inference and Neural network Optimization) toolkit 2022 – deploy high-performance, deep learning inference
Intel® Edge Software Hub – edge compution software and packages
Intel® DevCloud for the Edge – allows you to actively prototype and experiment with AI workloads for computer vision

Firmware

Main Memory

Graphics

Integrated X^e,Gen 12 graphics engine, 4 displays
Codec support HEVC/SCC/VP9/AV1
HDR support power optimized

Decode up to 8k60:

2x 4k60 8b 4:2:0 AVC
5k60 12b 4:2:2/4:4:4 HEVC/VP9/SCC
8k60 12b 4:2:0 HEVC/VP9/SCC
4k60 10b 4:2:0 AV1

Encode up to 8k30:

2x 4k60 8b 4:2:0 AVC
5k60 10b 4:4:4 HEVC/VP9/SCC
8k30 10b 4:2:0 HEVC/VP9/SCC
2x 4k HEVC encode speed

Up to 4 displays supported:

1 Display: 8k60 HDR
2 Displays: 8k60 SDR or 4k120 HDR + 5k120 HDR
3 Displays: 4k60 HDR
4 Displays: 4k60 HDR

DisplayPort DP1.4a HBR3
Multi-Stream Transport (MST) – display daisy chaining
Integrated DP Alt Mode MUX
Integrated audio

Display front panel options:

3 x Type-C connectors for either DisplayPort and USB usage
4^th DisplayPort optional via Type-C connector on low profile mezzanine card S40 or S48

Networking

Up to 7 Ethernet networking interfaces in total
3 x Front 2.5GBASE-T RJ45 – 3 x Intel® I226-IT NIC
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T connections
RJ45 Front port 1 – Intel® I226-IT, Intel® vPro®/AMT (Wake on LAN)
RJ45 Front port 2 – Intel® I226-IT, TCC/TSN capable, PPS/PPM
RJ45 Front port 3 – Intel® I226-IT, TCC/TSN capable
Integrated TCC/TSN controller for front ports 2 & 3 (RM590E PCH) – Real Time networking
TSN Precision time protocol (Time-Sensitive-Networking) as required e.g. for OPC UA and OpenAvnu
Enables ultra-reliable low-latency communication (URLLC)
Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness
Option Wi-Fi w. S43-WLAN mezzanine module (M.2 socket)
Option 2 x 2.5GBASE-T J2 backplane w. P82-GBE low profile mezzanine module – 2 x Intel® I226-IT NIC
Option 4 x 2.5GBASE-T RJ45 front w. SCJ-VEENA side card – 4 x Intel® I226-IT NIC (8HP assembly)
Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM side card – 4 x Intel® I210-IT NIC (8HP assembly)
Option RJ45 port 1 jack (vPro®/AMT) replacement by M12-X connector w. S02-M12 mezzanine (8HP)

Security

Front Panel I/O (4HP)

3 x 2.5 Gigabit Ethernet RJ45 receptacles
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te
Intel® vPro®/AMT supported (port 1 RJ45 connector – must be enabled via BIOS settings)
Port 2 & 3 TCC/TSN enabled

3 x 10Gbps USB Type-C receptacles DisplayPort Alt Mode
USB and/or DisplayPort usage
USB 3.2 Gen 2×1 (formerly USB 3.1 Gen2) SuperSpeed+ 10Gbps
USB-PD downstream facing ports 5V/3A (Infineon CYPD5225 EZ-PDT CCG5 controller)
DisplayPort 1.4
Additional Type-C front I/O with low profile mezzanine e.g. S48

Front Panel I/O (8/12HP)

CompactPCI® (J1) Backplane Compliance

CompactPCI® PlusIO (J2) Backplane Resources

Local Expansion & Mezzanine Mass Storage Options

Mezzanine side card connectors for optional local expansion
Low profile mezzanine modules available (4HP front panel)
Side cards available (8HP F/P assembly)
HSE1 – PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
HSE2 – PCIe Gen3 x4 (configurable also 2×2, 4×1), 4thDisplayPort
EXP – Legacy interface (eSPI, Audio, UART, I2C, GPIO)
GBE – 2 x 2.5GBASE-T

4HP Low profile mezzanine module preferred options:

S43-WLAN Mezzanine module – M.2 2280 SSD socket, M.2 2230 SSD socket, M.2 Wi-Fi module socket
S48-SSD Mezzanine module – 2 x M.2 2280 NVMe SSD sockets, 1 x USB Type-C
P82-GBE Mezzanine module – 1 x M.2 2280 NVMe, 2 x backplane (J2) 2.5GbE ports
Custom specific storage & I/O module design

8HP Mezzanine side card options:

SCJ-VEENA Short side card – M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
SCL-RHYTHM Short side card – M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
SCY-BOOST Short side card – 2 x M.2 2280 NVMe SSD socket, front panel I/O
PCZ-NVM Dual M.2 NVMe SSD, quad UART
S02-M12 – RJ45 port 1 (vPro®/AMT) replacement by M12-X connector (top or bottom mount)
Custom specific side card design – I/O and storage

Applications

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature 0°C to +70°C
Operating temperature -40°C to +85°C (industrial temperature range) on request
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 25.3 years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)

Simplified Block Diagram

Product Lifecycle

In Development
This product is currently under development and not yet available.
Active Product
This product is available for purchase and actively supported.
NRFND
"Not Recommended for New Designs" – we suggest avoiding this product for new projects.
EOL
"End of Life" – this product is discontinued and no longer available.

PC9-TOCCATA

CompactPCI® PlusIO Card • Intel® XEON® W 11xxx (Tiger Lake)

EKF Elektronik GmbH

Products

Industries

EKF

EKF

Social Media

PC9-TOCCATA

CompactPCI® PlusIO Card • Intel® XEON® W 11xxx (Tiger Lake)

EKF Elektronik GmbH

Products

Industries

EKF

EKF

Social Media

Release Notes for Phoenix UEFI/BIOS Firmware on EKF PC9-TOCCATA

2026-08-17: UEFI/BIOS release, Build #102 production

2026-05-29: UEFI/BIOS release, Build #100 production

2026-04-16: UEFI/BIOS release, Build #098 production

2026-03-23: UEFI/BIOS release, Build #096 production

2026-02-18: UEFI/BIOS release, Build #094 production

2026-02-03: UEFI/BIOS release, Build #092 production

2025-12-08: First BIOS production release, Build #090