SC9-TOCCATA

CompactPCI® Serial CPU Card • Intel® XEON® W 11xxx (Tiger Lake)

The SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.

The SC9-TOCCATA front panel is provided with three 2.5Gbps Ethernet jacks for networking (2 x TCC/TSN capable) and three 10Gbps USB Type-C receptacles (DisplayPort Alternate Mode enabled) for versatile device and display attachment.

On-board mass-storage solutions are based on low profile mezzanine expansion cards, which accommodate up to two M.2 style SSD modules. One of the M.2 sockets is suitable for a fast NVMe (PCI Express® Gen4 x 4) module.

The SC9-TOCCATA is equipped with up to 64GB DDR4 ECC RAM. Up to 32GB memory-down are provided for rugged applications, and another 32GB are available via the DDR4 ECC SODIMM socket.

The 11th Generation XEON® and Core™ processors are accompanied by the RM590E mobile PCH, for a maximum of high speed I/O resources (e.g. PCI Express®, SATA, USB). Altogether with the processor, 25 PCIe® lanes in total are provided for backplane use, and another 8 lanes for local mezzanine expansion up to PCIe® Gen4 speed.

As an option, up to eight additional Gigabit Ethernet ports (either switch or NICs) are available via the backplane connector P6 by means of a mezzanine module.

Downloads & Resources

Documents

Application Notes

Power Event (Power Down)

Firmware

Firmware Update

Release Notes

Drivers

Ordering Information

SC9-440D-TOCCATA	3U/4HP Xeon W-11865MLE 8C 1.5/4.5GHz,25W, PCH RM590E 16GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART Backplane CPCI-S.0 P1-P5 (P6 opt)
SC9-650D-TOCCATA	3U/4HP Xeon W-11865MRE 8C 2.6/4.7GHz,45W, PCH RM590E 32GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART Backplane CPCI-S.0 P1-P5 (P6 opt)
SC9-S550-TOCCATA	3U/4HP Xeon W-11865MRE 8C 2.6/4.7GHz,45W, PCH RM590E 32GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART, SC9-650D+S48-P200
SC9-S551-TOCCATA	3U/4HP Xeon W-11865MRE 8C 2.6/4.7GHz,45W, PCH RM590E 32GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART, SC9-650D+S48-P100
SC9-S570-TOCCATA	3U/4HP Xeon W-11865MRE 8C 2.6/4.7GHz,45W, PCH RM590E 32GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART, Bundle SC9-650D+S82-P100
SC9-S5X0-TOCCATA	3U/4HP Xeon W-11865MRE 8C 2.6/4.7GHz,45W, PCH RM590E 32GB on-board DDR4+ECC, 3xTypeC DP-Alt, 3×2.5Gbe Local Exp:8xPCIe,1xTypeC DP-Alt,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART, SC9-650D+SCX-P100

Expansion Modules

Low Profile Mezzanine Modules

S20

S40

S43

S48

Low Profile Mezzanine Modules

S80

S82

S83

8HP Mezzanine Modules

S02

Side Cards

SCJ

SCL

SCY

SCZ

Backplane Coupler

SCX

ECX

Specifications

General

PICMG® CompactPCI® Serial (CPCI-S.0) CPU card
Form factor single size Eurocard (board dimensions 100x160mm2)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
Front panel I/O connectors for typical system configuration (3 x 10Gbps USB Type-C DP Alt Mode, 3 x2.5Gbps Ethernet RJ45)
Backplane communication via PCI Express® up to Gen4, SATA 6G, USB 3.2, Gigabit Ethernet
New AirMax VSe® backplane connectors up to 25Gb/s differential pair
Local mezzanine expansion option, COTS and custom specific boards

Processor Characteristics

Intel® 11th Generation Mobile XEON® W or Core™ processor
Tiger Lake H45 platform
Up to 8-core, up to 3MB cache per core
DDR4 3200 ECC RAM
Gen 12 graphics, 4 displays up to 8k60
TCC/TSN
Extended temperature operation (CPU junction temperature range T_j up to -40°C to +100°C)
Embedded & industrial use conditions
45/35W configurable TDP, 25W TDP
BGA soldered for optimum reliability
Mobile Intel® Series 500 PCH (RM590E IOTG)

Intel® Xeon® W processors (Industrial Use Case *)
Up to 8 cores, 24MB cache, 32EU, Intel® vPro™ eligible
W-11865MRE | 8c 24M | 4.7GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j -40° C to +100° C | SC9-650D-TOCCATA
W-11555MRE | 6c 12M | 4.5GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j -40° C to +100° C
W-11155MRE | 4c 8M | 4.4GHz Turbo | 2.4GHz Base | 45/35W | 16EU 1250MHz | ECC | TCC/TSN | T_j -40° C to +100° C
W-11865MLE | 8c 24M | 4.5GHz Turbo | 1.5GHz Base | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j 0° C to +100° C | SC9-440D-TOCCATA
W-11555MLE | 6c 12M | 4.4GHz Turbo | 1.9GHz Base | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | T_j 0° C to +100° C
W-11155MLE | 4c 8M | 3.1GHz Turbo | 1.8GHz Base | 25W | 16EU 1250MHz | ECC | TCC/TSN | T_j 0° C to +100° C | SC9-340D-TOCCATA

* disable core/graphics turbo for industrial use condition

Intel® Core™ processors (Embedded Use Case)
i7-11850HE | 8c 24M | 4.7GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | VPro | T_j 0° C to +100° C
i5-11500HE | 6c 12M | 4.5GHz Turbo | 2.6GHz Base | 45/35W | 32EU 1350MHz | VPro | T_j 0° C to +100° C
i3-11100HE | 4c 8M | 4.4GHz Turbo | 2.4GHz Base | 45/35W | 16EU 1250MHz | T_j 0° C to +100° C
6600HE | 2c 8M | 2.6GHz | 35W | 16EU 1100MHz | T_j 0° C to +100° C | SC9-140D-TOCCATA
6600HLE | 2c 8M | 2.1GHz | 25W | 16EU 1100MHz | T_j 0° C to +100° C

Board Power Requirements

+5V STANDBY ±10% (optional)

10mA (S0, S3 Sleep, S4 Hibernate, S5 Soft Off
250mA when +12V is switched off (PSON#)

+12V ±10% 6.65A rated

S0 active state see sample CPU types below
300mA (S3 Sleep, S4 Hibernate
0mA (S5 Off)

SC9-650D, W-11865MRE (2.6GHz), CPU-ID 0x806D1, 32GB+32GB DDR4-3200, SC9 Rev1 w. BIOS #082

Bal

Perf

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PerfTrb.

Test Config

0.9A

1.5A

0.9A

1.7A

Win11 Idle

2.9A

3.4A

3.0A

5.5A

TAT: CPU0-7 60%, Gfx 100%

3.5A

4.1A

6.1A

6.5A

TAT 100%

1.3A

1.8A

2.8A

3.3A

TAT: CPU0 100%

2.9A

3.4A

6.0A

6.4A

Passmark BurnIn Test

SC9-440D, W-11865MLE (1.5GHz) CPU-ID 0x806D1, 16GB+0GB DDR4-3200, SC9 Rev.2 w. BIOS #088

Bal

Perf

Bal Trb.

PerfTrb.

Test Config

0.7A

1.2A

0.8A

1.3A

Win11 Idle

1.5A

1.9A

2.2A

4.9A

TAT: CPU0-7 60%, Gfx 100%

2.2A

2.6A

6.0A

6.3A

TAT 100%

0.9A

1.3A

2.4A

2.8A

TAT: CPU0 100%

1.7A

2.1A

5.9A

6.2A

Passmark BurnIn Test

Comments:
Win11/64bit, SC9 w. S20+SSD Samsung 980PRO
Intel Power and Thermal Analysis Tool (PTAT) Version 02.01.1008
Passmark BurnInTest V10.2, Config: CPU Max. Heat; RAM Standard Mode; GPGPU
All measurements w/o network cabling. Add 12V 50/110mA (link only / active) @2.5Gbps
typically per Ethernet port

AI (Artificial Intelligence) Resources

DL Boost – set of instructions to accelerate AI workloads
AVX512 – Advanced Vector Extensions & VNNI – Vector Neural Network Instructions – X86 instruction set which is designed to accelerate convolutional neural network for INT8 inference, helps accelerate workloads like image recognition
GNA – Gaussian & Neural Accelerator – a low-power neural coprocessor for continuous inference at the edge, designated for offloading workloads including but not limited to noise reduction or speech recognition, saves power and frees CPU resources
Intel® OpenVINO™ (Open Visual Inference and Neural network Optimization) toolkit 2022 – deploy high-performance, deep learning inference
Intel® Edge Software Hub – edge compution software and packages
Intel® DevCloud for the Edge – allows you to actively prototype and experiment with AI workloads for computer vision

Firmware

Main Memory

Graphics

Integrated X^e,Gen 12 graphics engine, 4 displays
Codec support HEVC/SCC/VP9/AV1
HDR support power optimized

Decode up to 8k60:

2x 4k60 8b 4:2:0 AVC
5k60 12b 4:2:2/4:4:4 HEVC/VP9/SCC
8k60 12b 4:2:0 HEVC/VP9/SCC
4k60 10b 4:2:0 AV1

Encode up to 8k30:

2x 4k60 8b 4:2:0 AVC
5k60 10b 4:4:4 HEVC/VP9/SCC
8k30 10b 4:2:0 HEVC/VP9/SCC
2x 4k HEVC encode speed

Up to 4 displays supported:

1 Display: 8k60 HDR
2 Displays: 8k60 SDR or 4k120 HDR + 5k120 HDR
3 Displays: 4k60 HDR
4 Displays: 4k60 HDR

DisplayPort DP1.4a HBR3
Multi-Stream Transport (MST) – display daisy chaining
Integrated DP Alt Mode MUX
Integrated audio

Display front panel options:

3 x Type-C connectors for either DisplayPort and USB usage
4^th DisplayPort optional via Type-C connector on low profile mezzanine card S40 or S48

Networking

Up to 11 Gigabit Ethernet networking interfaces in total
3 x Front 2.5GBASE-T RJ45 – 3 x Intel® I226-IT NIC
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T connections
RJ45 Front port 1 – Intel® I226-IT, Intel® vPro®/AMT (Wake on LAN)
RJ45 Front port 2 – Intel® I226-IT, TCC/TSN capable, PPS/PPM
RJ45 Front port 3 – Intel® I226-IT, TCC/TSN capable
Integrated TCC/TSN controller for front ports 2 & 3 (RM590E PCH) – Real Time networking
TSN Precision time protocol (Time-Sensitive-Networking) as required e.g. for OPC UA and OpenAvnu
Enables ultra-reliable low-latency communication (URLLC)
Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness
Option Wi-Fi w. S43-WLAN mezzanine module (M.2 socket)
Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module – Marvell® Peridot switch
Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module – 4 x Intel® I210-IT NIC
Option 4 x 2.5GBASE-T backplane w. S83-P6 mezzanine module – 4 x Intel® I226-IT NIC
Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card – 4 x Intel® I226-IT NIC (8HP assy)
Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM short side card – 4 x Intel® I210-IT NIC (8HP assy)
Option RJ45 port 1 jack (vPro®/AMT) replacement by M12-X connector w. S02-M12 mezzanine (8HP)

Security

Front Panel I/O (4HP)

3 x 2.5 Gigabit Ethernet RJ45 receptacles
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te
Intel® vPro®/AMT supported (port 1 RJ45 connector – must be enabled via BIOS settings)
Port 2 & 3 TCC/TSN enabled

3 x 10Gbps USB Type-C receptacles DisplayPort Alt Mode
USB and/or DisplayPort usage
USB 3.2 Gen 2×1 (formerly USB 3.1 Gen2) SuperSpeed+ 10Gbps
USB-PD downstream facing ports 5V/3A (Infineon CYPD5225 EZ-PDT CCG5 controller)
DisplayPort 1.4
Additional Type-C front I/O with low profile mezzanine S40 or S48

Front Panel I/O (8/12HP)

CompactPCI® Serial Backplane Resources

PICMG® CPCI-S.0 CPU card & system slot controller
16 x PCIe Gen4 ¹ 16GT/s (2 links x8 for two fat pipe slots, derived directly from the Xeon® or Core™ CPU)
9 x PCIe Gen3 8GT/s (1 link x4, 5 links x1 for peripheral slots, derived from the PCH)
5 x SATA 6G (from the PCH)
8 x USB3 ² (from the PCH)
Option 8 x Gigabit Ethernet Marvell 88E6390 switch (S80-P6 low profile mezzanine expansion card)
Option 4 x Gigabit Ethernet Intel® I210-IT NIC (S82-P6 low profile mezzanine expansion card)
Option 4 x 2.5Gigabit Ethernet Intel® I226-IT NIC (S83-P6 low profile mezzanine expansion card)

New backplane connectors AirMax VSe® up to 25Gbps per differential pair according to CompactPCI® Serial R3.0 (backward compatible to backplanes with AirMax VS® 12.5Gbps)
4HP CPU card front panel width when the adjacent board to the right is equipped with legacy AirMax VS® connectors (e.g. peripheral cards according to the CompactPCI® Serial R2.0 connector specification)
5HP CPU card front panel width and backplane slot pitch according to CompactPCI® Serial R4.0 when the adjacent board to the right is also equipped with the new AirMax VSe® connectors (e.g. multi CPU card system)

¹ The CPU is PCIe® Gen4 capable on these links (specified with CompactPCI® Serial R3.0)
² USB 3.2 Gen 2×1 SuperSpeed+ 10Gbps

Local Expansion & Mezzanine Mass Storage Options

Mezzanine side card connectors for optional local expansion
Low profile mezzanine modules available (4HP front panel)
Side cards available (8HP F/P assembly)
HSE1 – PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
HSE2 – PCIe Gen3 x4 (configurable also 2×2, 4×1), 4thDisplayPort
EXP – Legacy interface (eSPI, Audio, UART, I2C, GPIO)

4HP Low profile mezzanine module preferred options:
S20-NVME Mezzanine module – M.2 2280 NVME SSD socket, 1 x Type-C USB F/P connector
S40-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P connectors (1 connector enabled for DisplayPort alternate mode)
S42-MC Mezzanine module – M.2 2280 NVME SSD socket, 2 x PCIe® Mini Card sockets
S48-SSD Mezzanine module – 1 x M.2 2280 PCIe® x4 Gen4 SSD socket, 1 x M.2 2280 PCIe® x4 Gen3 SSD socket, Type-C USB F/P connector (enabled for DisplayPort alternate mode – 4th display)
S80-P6 Mezzanine module – M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector (switch based solution)
S82-P6 Mezzanine module – M.2 NVMe SSD socket, 4 x GbE NIC via P6 backplane connector
S83-P6 Mezzanine module – M.2 NVMe SSD socket, 4 x 2.5GbE NIC via P6 backplane connector
Custom specific storage & I/O module design

8HP Mezzanine side card options:
SCJ-VEENA Short side card – M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
SCL-RHYTHM Short side card – M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
SCZ-NVM – M.2 22110 NVMe SSD socket, quad UART, DisplayPort & USB3 connectors
S02-M12 – RJ45 port 1 (vPro®/AMT) replacement by M12-X connector (top or bottom mount)
Custom specific side card design – I/O and storage

Backplane Coupler:
SCX-PCIE – M.2 2280 NVMe/SATA SSD socket, PCIe® Mini Card socket, 3 x USB3, 3 x GbE RJ45 connectors, coupler for secondary CompactPCI® Serial backplane
ECX-PCIE – Front I/O same as SCX, coupler for CompactPCI® Express secondary backplane

Applications

Environmental & Regulatory

Suitable e.g. for industrial, transportation & instrumentation applications
Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature 0°C to +70°C
Operating temperature -40°C to +85°C (industrial temperature range) on request
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 20.2 years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)
Railway conformity EN50155 OT3+ST1, PC2, EN45545-7 HL3

Simplified Block Diagram

Product Lifecycle

In Development
This product is currently under development and not yet available.
Active Product
This product is available for purchase and actively supported.
NRFND
"Not Recommended for New Designs" – we suggest avoiding this product for new projects.
EOL
"End of Life" – this product is discontinued and no longer available.

SC9-TOCCATA

CompactPCI® Serial CPU Card • Intel® XEON® W 11xxx (Tiger Lake)

EKF Elektronik GmbH

Products

Industries

EKF

EKF

Social Media

SC9-TOCCATA

CompactPCI® Serial CPU Card • Intel® XEON® W 11xxx (Tiger Lake)

EKF Elektronik GmbH

Products

Industries

EKF

EKF

Social Media

Release Notes for Phoenix UEFI/BIOS Firmware on EKF SC9-FESTIVAL

2025-12-08: BIOS release, Build #090 production

2025-10-13: BIOS release, Build #088 production

2025-09-16: BIOS release, Build #086 production

2025-09-04: BIOS release, Build #084 production

2025-06-21: BIOS release, Build #082 production

2025-04-10: BIOS release, Build #080 production

2024-09-30: BIOS release, Build #076 production

2024-08-09: BIOS release, Build #074 production

2024-04-25: BIOS release, Build #072 production

2023-10-30: First BIOS production release, Build #070