SCA-THUNDER

Mobile Intel® Core™ Ultra H Processor

The SCA-THUNDER is a rich featured high performance 5HP (also legacy 4HP) 3U CompactPCI® Serial CPU board, equipped with a powerful Intel® Core™ Ultra series 100/200-H processor for advanced industry use cases. Multiple different compute engines such as P-cores, E-cores, Intel® Arc™ GPU, and Intel® AI Boost, work together to accelerate e.g. AI-augmented industrial process control (AIPC) or machine control. The SCA-THUNDER front panel is provided with three 2.5Gbps RJ45 Ethernet jacks for networking, and up to four 10Gbps USB Type-C receptacles (DisplayPort Alternate Mode enabled) for versatile USB device and display attachment, up to 4 x 4k displays.
The SCA-THUNDER can be equipped with up to 96GB DDR5-6400 RAM via two channels, soldered memory-down provided for rugged applications, and additionally 64GB available via the SODIMM socket. On-board mass[1]storage solutions are based on a variety of low profile mezzanine expansion cards available, which accommodate amongst other functions a fast PCI Express® Gen4 x4 NVMe® SSD module
Full support for CPCI® Serial backplanes is provided, e.g. a fat pipe slot for a PCIe® Gen5 x8 peripheral card. As an option, up to eight Gigabit Ethernet ports are available via the backplane connector P6 by means of a mezzanine module.

Downloads & Resources

Documents

Application Notes

Power Event (Power Down)

Drivers

Intel® Driver & Support Assistant

Expansion Modules

Low Profile Mezzanine Modules

S20

S40

S48

Low Profile Mezzanine Modules

S80

S82

S83

8HP Mezzanine Modules

S02

Side Cards

SCJ

SCL

SCY

SCZ

Backplane Coupler

SCX

ECX

Specifications

General

PICMG® CompactPCI® Serial (CPCI-S.0) CPU card (system slot controller)
Form factor single size Eurocard (board dimensions 100x160mm2)
Mounting height 3U
Front panel width 4HP for current CPCI-S.0 R3.0 backplanes
Front panel width 5HP for future CPCI-S.0 R4.0 backplanes
F/P width 4HP/5HP with low profile mezzanine module assembly
F/P width 8HP/12HP (9HP/13HP) as an assembly with optional mezzanine side cards
Front panel I/O connectors for typical system configuration (3 x 10Gbps USB Type-C DP Alt Mode, 3 x 2.5Gbps Ethernet RJ45)
Backplane communication via PCI Express® up to Gen5, SATA 6G, USB3, 2.5Gbps Ethernet
New AirMax VSe® backplane connectors
Variety of local mezzanine expansion options, COTS and custom specific boards

Processor Characteristics

Intel^® Core™ Ultra processors series-1 & series-2 (H type)
Formerly known as Meteor Lake & Arrow Lake H platform
Up to 16 cores, up to 22 threads
Multiple compute engines in one SoC: P-cores, E-cores, Intel^®Arc™ GPU and Intel^® AI Boost NPU
Up to 96GB DDR5-6400 RAM, dual channel
Intel^® Arc™ graphics up to eight X^e cores, up to 128 execution units, up to 4 displays 4 x 4k or 2 x 8k
Integrated Neural Processing Unit (NPU)
28 PCIe^® lanes Gen4/5
28W base power
45W base power high performance SKU (long term availability tbd)
BGA soldered for optimum reliability
Max. operating temperature 110°C
Intel^® pilot program for custom use conditions that have more challenging condition requirements

Line-up Intel^® Core™ Ultra 100H series processors (Meteor Lake), DDR5-5600:

Core™ Ultra 9 185H: 16 cores, 22 threads, 24MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 7 165H: 16 cores, 22 threads, 24MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 7 155H: 16 cores, 22 threads, 24MB L3 cache, 8 X^e 128 EUs
Core™ Ultra 5 135H: 14 cores, 18 threads, 18MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 5 125H: 14 cores, 18 threads, 18MB L3 cache, 7 X^e 112 EUs

Line-up Intel^® Core™ Ultra 200H series processors (Arrow Lake), DDR5-6400:

Core™ Ultra 9 285H: 16 cores, 16 threads, 24MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 7 265H: 16 cores, 16 threads, 24MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 7 255H: 16 cores, 16 threads, 24MB L3 cache, 8 X^e 128 EUs
Core™ Ultra 5 235H: 14 cores, 14 threads, 18MB L3 cache, 8 X^e 128 EUs, vPro^®
Core™ Ultra 5 225H: 14 cores, 14 threads, 18MB L3 cache, 7 X^e 112 EUs

AI (Artificial Intelligence) Resources

Intel® Deep Learning Boost DP4a – 8-bit INT acceleration on Xe graphics
Intel® Deep Learning Boost VNNI – 8-bit INT acceleration on CPU cores as part of Intel® AVX instructions
Intel® NPU – Integrated Neural Processing Unit V 2.7 (Intel® AI Boost)
Intel® GNA – Gaussian & Neural Accelerator V 3.5 – a low-power neural coprocessor
Intel® OpenVINO™ (Open Visual Inference and Neural network Optimization) toolkit – deploy high – performance, deep learning inference
WindowsML
DirectML
ONNX RT
Intel® Edge Software Hub – edge compution software and packages
Intel® DevCloud for the Edge – allows you to actively prototype and experiment with AI workloads for computer vision

Firmware

Main Memory

Integrated memory controller up to 96GB DDR5 5600 MT/s, dual channel (series 100 processors)
Integrated memory controller up to 96GB DDR5 6400 MT/s, dual channel (series 200 processors)
External clock driver according to Jedec specification DDR5CKD01 as required for DDR5-6400
DDR5 soldered memory up to 32GB (ultra rugged basic memory)
DDR5 SO-DIMM memory module socket up to 64GB (memory expansion option)

Graphics

Networking

Up to 11 Ethernet networking interfaces in total
3 x Front 2.5GBASE-T RJ45 – 3 x Intel® I226-IT NIC
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T connections
RJ45 Front port 1 – Intel® vPro®/AMT (Wake on LAN) with eligible processors
Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module – Marvell® Peridot switch
Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module – 4 x Intel® I210-IT NIC
Option 4 x 2.5GBASE-T backplane w. S83-P6 mezzanine module – 4 x Intel® I226-IT NIC
Option 4 x 2.5GBASE-T RJ45 front w. SCJ-VEENA side card – 4 x Intel® I226-IT NIC (8HP assembly)
Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM side card – 4 x Intel® I210-IT NIC (8HP assembly)
Option RJ45 port 1 jack (vPro®/AMT) replacement by M12-X connector w. S02-M12 mezzanine (8HP)

Security

Front Panel I/O (4HP)

3 x 2.5Gbps Ethernet RJ45 receptacles
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te
Intel® vPro®/AMT supported (port 1 RJ45 connector – must be enabled via BIOS settings)
3 x 10Gbps USB Type-C receptacles DisplayPort Alt Mode
USB and/or DisplayPort usage
USB 3.2 Gen 2×1 (formerly USB 3.1 Gen2) SuperSpeed+ 10Gbps
USB-PD downstream facing ports 5V/3A (Infineon CYPD5225 EZ-PD™ CCG8 controller)
DisplayPort 2.1
Additional Type-C front I/O with low profile mezzanine e.g. S40 or S48

Front Panel I/O (8/12HP)

CompactPCI® Serial Backplane Resources

PICMG® CPCI-S.0 CPU card & system slot controller
8 x PCIe Gen5 1 up to 32GT/s (fat pipe peripheral card slot)
8 x PCIe Gen4 1 up to 16GT/s (2 peripheral card slots x4)
5 x PCIe Gen3 up to 8GT/s (5 peripheral card slots x1)
2 x SATA 6G
8 x USB2, 4 x USB3 5Gbps
Option 8 x Gigabit Ethernet Marvell 88E6390 switch (S80-P6 low profile mezzanine expansion card)
Option 4 x Gigabit Ethernet Intel® I210-IT NIC (S82-P6 low profile mezzanine expansion card)
Option 4 x 2.5Gigabit Ethernet Intel® I226-IT NIC (S83-P6 low profile mezzanine expansion card)

New backplane connectors AirMax VSe® up to 25Gbps per differential pair according to CompactPCI® Serial R3.0 (backward compatible to backplanes with AirMax VS® 12.5Gbps)
4HP CPU card front panel width when the adjacent board to the right is equipped with legacy AirMax VS® connectors (e.g. peripheral cards according to the CompactPCI® Serial R2.0 connector specification)
5HP CPU card front panel width and backplane slot pitch according to CompactPCI® Serial R4.0 when the adjacent board to the right is also equipped with the new AirMax VSe® connectors (e.g. multi CPU card system)

1 The CPU is PCIe® Gen4 or Gen5 capable on these links (specified with CompactPCI® Serial R3.0)

Local Expansion & Mass Storage Options

Mezzanine side card connectors for optional local expansion
Low profile mezzanine modules available (4HP front panel)
Side cards available (8HP F/P assembly)
HSE1 – PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
HSE2 – PCIe Gen3 (configurable 2×2, 4×1), 4thDisplayPort
UTIL – Legacy interface (UART, GPIOs, Reset#, I2C, PPS, SYNC, BAT)

4HP Low profile mezzanine module preferred options:

S20-NVME Mezzanine module – M.2 2280 NVME SSD socket, 1 x Type-C USB F/P connector
S40-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P connectors (1 connector enabled for DisplayPort alternate mode)
S42-MC Mezzanine module – M.2 2280 NVME SSD socket, 2 x PCIe® Mini Card sockets
S48-SSD Mezzanine module – 1 x M.2 2280 PCIe® x4 Gen4 SSD socket, 1 x M.2 2280 PCIe® x4 Gen3 SSD socket, Type-C USB F/P connector (enabled for DisplayPort alternate mode – 4th display)
S80-P6 Mezzanine module – M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector (switch based solution)
S82-P6 Mezzanine module – M.2 NVMe SSD socket, 4 x GbE NIC via P6 backplane connector
S83-P6 Mezzanine module – M.2 NVMe SSD socket, 4 x 2.5GbE NIC via P6 backplane connector
Custom specific storage & I/O module design

8HP Mezzanine side card options:

SCJ-VEENA Short side card – M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
SCL-RHYTHM Short side card – M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
SCZ-NVM – M.2 22110 NVMe SSD socket, quad UART, DisplayPort & USB3 connectors
S02-M12 – RJ45 port 1 (vPro®/AMT) & port 3 replacement by M12-X connector
Custom specific side card design – I/O and storage

Backplane Coupler:

SCX-PCIE – M.2 2280 NVMe/SATA SSD socket, PCIe® Mini Card socket, 3 x USB3, 3 x GbE RJ45 connectors, coupler for secondary CompactPCI® Serial backplane
ECX-PCIE – Front I/O same as SCX, coupler for CompactPCI® Express secondary backplane

RT OS Board Support Packages & Driver

Applications

Environmental & Regulatory

Suitable e.g. for industrial, transportation & instrumentation applications
Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature 0°C to +70°C
Operating temperature -40°C to +85°C (industrial temperature range) on request
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF tbd years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)

Simplified Block Diagram

Product Lifecycle

In Development
This product is currently under development and not yet available.
Active Product
This product is available for purchase and actively supported.
NRFND
"Not Recommended for New Designs" – we suggest avoiding this product for new projects.
EOL
"End of Life" – this product is discontinued and no longer available.

SCA-THUNDER

Mobile Intel® Core™ Ultra H Processor

EKF Elektronik GmbH

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