S83-P6

Low Profile Mezzanine Module for CompactPCI® Serial CPU Cards

Available as a mezzanine add-on expansion board e.g. to the SC5-FESTIVAL and successor CPU carrier cards, the main purpose of the S83-P6 is to provide a Solid State Drive mass storage solution, and in addition to supply the backplane with four Gigabit Ethernet ports.

The S83-P6 is equipped with an M.2 PCIe® Gen4 x4 socket, suitable for an NVMe type SSD module. The maximum PCIe® data transfer rate depends on the particular CPU carrier card (16GT/s require SC9-TOCCATA).

Four discrete Gigabit Ethernet controllers are provided on-board, for CompactPCI® Serial backplane communication via the P6 connector according to the 2.5GBASE-T interface standard. The S83-P6 is equipped in addition with a Type-C front port for attachment of an USB device or DisplayPort monitor.

The Intel® I226-IT 2.5GbE controllers support latest networking features and are backward compatible to 1000BASE-T as originally specified by the CompactPCI® Serial specification. With a suitable Ethernet enabled CompactPCI® Serial backplane, both networking architectures are supported, either single star or full mesh.

The S83-P6 connects to the mezzanine expansion connectors HSE1 and HSE2 of the CompactPCI® Serial CPU carrier board, maintaining the 4HP (20.32mm) total assembly height

Downloads & Ressources

Documents

Specifications

S83-P100-P6	Mezzanine module, stack height 10.8mm (low profile) 4 x 2.5GbE (I226) via P6 M.2 NVMe SSD PCIe x4 USB Type-C front I/O DP Alt Mode add-on for HSE1/HSE2 mezzanine connector based CPU

Specifications

Form Factor

Proprietary size mezzanine module – low profile
Fits basically into the 4HP (20.32mm) envelope of the CPU carrier board
Typically delivered as a ready to use assembly unit (including CPU card)
Mounting position right (on top of a CPU board)

Eligible CPU Carrier Cards

M.2 Module Connector

Single M.2 socket, maximum M.2 SSD size 2280 (M.2 formerly known as NGFF)
Suitable for M.2 NVMe SSD module, key Id M, PCIe® x4 I/F
Autosense option for SATA SSD (depends on carrier card)
PCIe® x4 up to Gen4 sourced via HSE1 mezzanine connector
Maximum (theoretical) 64Gbps I/O data transfer rate (Gen4 PCIe 16GT/s)
Module dimensions 2230/2242/2260/2280, screw fixed (2280 w. locking bar)
M.2 Module height (Label) S3 – top side component height 1.5mm max., no bottom side components
Module 3.3V power DC/DC regulator can be switched off/on via I2C (BIOS settings)

Type-C Front I/O

P6 CompactPCI® Serial Backplane Connector

Host I/F Connectors

HSE1

HSE2

Gigabit Ethernet NICs

Four individual Intel® I225/226-IT networking interface controllers (NIC)
2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T 802.3 specifications
-40°C to +85°C operating temperature 10M/100M/1G
-40°C to +70°C operating temperature 2.5G (I225)
-40°C to +85°C operating temperature 2.5G (I226)
UDP, TCP and IP checksum offload
9KB Jumbo Frame support
Four transmit and four receive queues
IEEE 802.3az Energy Efficient Ethernet
Ultra-low power at cable disconnect (5mW)
Time Sensitive Networking (TSN)
IEEE 1588 – Basic time-sync (Precision Time Protocol)
IEEE 802.1AS-Rev – Higher precision time synchronization with multiple (dual) clock masters
IEEE 802.1Qav – Credit Based Shaping and Basic scheduling
IEEE 802.1Qbu – Frame Preemption
IEEE 802.1Qbv – Time Aware Shaper
IEEE 802.3br – Interspersing Express Traffic
PCIe® PTM for synchronization between the NIC and Host timers
Based on four PCI Expess® x1 links derived from the mezzanine connector HSE2
Driver support for all major operating systems
DC/DC power regulator for Ethernet NICs can be switched off/on via I2C (BIOS settings)

Applications

Low profile mezzanine module for EKF CPU Cards (SC5-FESTIVAL and later)
4HP assembly CPU carrier board and S83-P6 mezzanine card
Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe)
On-board 2.5GbE NICs for backplane communication and multiprocessing via backplane connector P6, four GbE ports (suitable for single star architecture or full mesh or RIO)
Additional monitor via Type-C DP Alt Mode

Environment & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature -40°C to +85°C industrial temperature range
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
EC Regulatory EN55035, EN55032, EN62368-1 (CE)
MTBF 58.1 years (MIL-HDBK-217F, SN29500 @+40°C)

Local Expansion

Mezzanine side card connectors for optional local expansion
Low profile mezzanine modules available (4HP front panel)
Side cards available (8HP F/P assembly)
HSE1 – PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
HSE2 – PCIe Gen3 x4 (configurable also 2×2, 4×1), 4thDisplayPort
EXP – Legacy interface (eSPI, Audio, UART, I2C, GPIO)

4HP Low profile mezzanine module preferred options:
S20-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x Type-C
S40-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C
S42-MC Mezzanine module – 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
S48-SSD Mezzanine Module – 2 x M.2 2280 NVME SSD sockets, 1 x Type-C
S80-P6 Mezzanine module – 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
S82-P6 Mezzanine module – M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
S83-P6 Mezzanine module – M.2 NVMe SSD socket, 4 x 2.5GbE NIC via P6 backplane connector
Custom specific storage & I/O module design

8HP Mezzanine side card options:
SCJ-VEENA Short side card – M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
SCL-RHYTHM Short side card – M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
SCZ-NVM – M.2 22110 NVMe SSD socket, quad UART, DisplayPort & USB3 connectors
S02-M12 – RJ45 port 1 (vPro®/AMT) replacement by M12-X connector (top or bottom mount)
Custom specific side card design – I/O and storage

Backplane Coupler:
SCX-PCIE – M.2 2280 NVMe/SATA SSD socket, PCIe® Mini Card socket, 3 x USB3, 3 x GbE RJ45 connectors, coupler for secondary CompactPCI® Serial backplane
ECX-PCIE – Front I/O same as SCX, coupler for CompactPCI® Express secondary backplane

RT OS Board Support Packages & Driver

Applications

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Storage temperature: -40°C to +85°C, max. gradient 5°C/min
Operating temperature 0°C to +70°C
Operating temperature -40°C to +85°C on request
Humidity 5% … 95% RH non Condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 20.2 years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

S83-P6

Low Profile Mezzanine Module for CompactPCI® Serial CPU Cards

EKF Elektronik GmbH

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