PC8-FLUTE

CompactPCI® PlusIO CPU Card • Intel® Atom™ x6000 Series Processor • Elkhart Lake SoC

The PC8-FLUTE is a low power CompactPCI® PlusIO CPU board, based on an Intel® Atom™ x6000RE (Elkhart Lake Industrial) System-on-Chip processor. The front panel is provided with three 2.5Gbps RJ45 Ethernet jacks, and three Type-C USB3/DisplayPort connectors. The board is equipped with 16GB directly soldered DDR4 IBECC RAM, and in addition a DDR4 SODIMM socket for another 16GB. High speed PCIe® x4 SSD mass storage is available via low profile mezzanine modules (4HP assembly), or multi-function side cards (8HP). The PC8-FLUTE backplane connectors comply with the CompactPCI® PlusIO specification, suitable for system expansion with classic CompactPCI® peripheral cards via J1, and in addition high speed I/O such as PCI Express® lanes and 2.5GBASE-T across J2.

Downloads & Ressources

Documents

Application Notes

Power Event (Power Down)

General Information

CompactPCI® PlusIO

Firmware

Firmware Update

Drivers

Intel® Driver & Support Assistant | SATA

Expansion Modules

Low Profile Mezzanine Modules

S48

Side Cards(8HP Assy)

PCZ

SCJ

Specifications

General

CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
Form factor single size Eurocard (board dimensions 100x160mm²)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
Front panel I/O connectors for typical system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
Backplane communication via CompactPCI® PlusIO connectors
J1 – PCI® 32bit 66MHz (PICMG® CPCI 2.0)
J2 – PCIe®, GbE, SATA, USB (PICMG® CPCI 2.30)
On-board PCIe® mezzanine expansion option for mass storage modules or side cards
Side cards and low profile mass storage modules available as COTS and also as custom specific

Processor

Intel® Atom™ Industrial SoC x6000RE Series (Elkhart Lake)
x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
x6416RE • 4 Cores • 1.7GHz • 9W TDP • 450MHz/16EUs Gfx
x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
x6214RE • 2 Cores • 1.4GHz • 6W TDP • 400MHz/16EUs Gfx
x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx

In-band ECC
Intel® Programmable Services Engine
Intel® Time Coordinate Computing (Intel® TCC) and TSN
Operating life 10 years up to 100% active
T_a -40°C to 85°C

Firmware

Main Memory

Mass Storage

128Mbit SPI Flash (UEFI firmware and customer application data)
SPI Flash 128Mbit (UEFI firmware and customer application data)
PCIe® based SSD module options via P-HSE1 & P-HSE2 mezzanine connectors
M.2 socket(s) on low profile mezzanine modules (4HP) or side cards (8HP)
Up to 2 x M.2 NVMe SSD size 2280, PCIe x4 (P-HSE1) and PCIe x1 (P-HSE2)
Up to 2 x 2TB as of current
Option custom specific mezzanine mass storage board design on request

Graphics

Networking

Up to 9 Multi-Gigabit Ethernet networking interfaces in total
3 x 2500BASE-T RJ45 front ports via SGMII PHYs Marvell® AQR115C
2 x 2500BASE-T backplane J2 connector (P82-GBE low profile mezzanine module – 2 x Intel® I226-IT)
Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card – 4 x Intel® I225-IT NIC (8HP assy)
TSN Precision time protocol (Time-Sensitive-Networking) as required for OPC UA and OpenAvnu
Enables ultra-reliable low-latency communication (URLLC)
Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness

EHL SoC I/O Usage

3 x USB Type-C front panel connectors (DP Alt Mode)
3 x 2.5GBASE-T SGMII PHYs to RJ45 front ports
4 x PCIe® Gen3 to HSE1 mezzanine connector (configurable 1×4 or 4×1 links)
4 x PCIe® Gen3 to HSE2 mezzanine connector (4×1 links via Gen3 PCIe® switch)
4 x PCIe® Gen3 to backplane connector J2 (x1 links, via PCIe® switch)
PCIe® Gen3 1:5 switch (1 x USB controller, 4 x HSE2 mezzanine)
PCIe® Gen3 1:5 switch (PCI® bridge to J1 backplane connector, 4 x PCIe® to J2)
4 x USB2 to J2 backplane connector
eSPI, Audio, I2C, UART, CAN-FD, Time Sync to mezzanine expansion connector N-EXP
TPM 2.0 module

Additional Building Blocks

Security

Front Panel I/O (4HP)

Front Panel I/O (8HP)

CompactPCI® (J1) Backplane Compliance

CompactPCI® PlusIO (J2) Backplane Resources

PICMG® CompactPCI® PlusIO CPU card (system slot controller)
Up to four PCIe® based CompactPCI® Serial peripheral cards on a hybrid backplane, Gen1/2/3 x1 links
PCIe® based rear I/O module
PCIe® links/lanes derived from PI7C9X3G606GP PCIe® Gen3 switch
Option 2 x 2.5GBASE-T Gigabit Ethernet via P82-GBE low profile mezzanine module (I226-IT NICs)
1 x SATA derived from EHL SoC
4 x USB2 from EHL SoC

Local Expansion

Mezzanine side card connectors for optional local expansion
HSE1 – High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
HSE2 – High speed expansion connector, PCIe® Gen3 configured 4×1, via PCIe® packet switch
N-EXP – Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)

4HP Low profile mezzanine module options (to be ordered separately)
S48-SSD Mezzanine Module – 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
P82-GBE Mezzanine module – 1 x M.2 2280 NVMe, 2 x backplane (J2) 2.5GbE ports
Custom specific module design

8HP Mezzanine side card option (to be ordered separately)
SCJ-VEENA Quad RJ45 2.5GbE NIC & M.2 SSD storage
PCZ-NVM Dual M.2 NVMe SSD, quad UART
Custom specific side card design

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature -40°C to +85°C (industrial temperature range)
Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
Humidity 5% … 95% RH non Condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF tbd years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)

RT OS Board Support Packages & Driver

Applications

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

PC8-FLUTE

CompactPCI® PlusIO CPU Card • Intel® Atom™ x6000 Series Processor • Elkhart Lake SoC

EKF Elektronik GmbH

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