SC8-FLUTE

CompactPCI® Serial CPU Card • Low Power Intel® Atom™ x6000RE SoC (Elkhart Lake)

The SC8-FLUTE is a low power CompactPCI® Serial CPU board, based on an Intel® Atom™ x6000RE (Elkhart Lake Industrial) System-on-Chip processor. The front panel is provided with three 2.5Gbps RJ45 Ethernet jacks, and three Type-C USB3/DisplayPort connectors. The board is equipped with 16GB directly soldered DDR4 IBECC RAM, and in addition a DDR4 SODIMM socket for another 16GB. High speed PCIe® x4 SSD mass storage is available via low profile mezzanine modules (4HP assembly), or multi-function side cards (8HP). The SC8-FLUTE backplane connectors comply with the CompactPCI® Serial system board specification, suitable for reasonable system expansion via 3 x PCIe®, 4 x SATA (two ports configurable as hardware RAID 0/1), and USB3.

Downloads & Ressources

Documents

Application Notes

Power Event (Power Down)

General Information

All you need to Know

Firmware

Firmware Update

Drivers

Intel® Driver & Support Assistant

Ordering Information

SC8-640F-FLUTE	3U/4HP Intel x6425RE Quad Core SoC 12W 16GB on-board DDR4, 3xTypeC DP-Alt, 32Gb EMMC 3×2.5Gbe Local Exp:8xPCIe,1xUSB3,2xUSB2, eSPI, HD-AUDIO, UART Backplane CPCI-S.0 P1-P5 (P6 opt)

Expansion Modules

Low Profile Mezzanine Modules

S20

S40

S42

S48

S80

S82

S83-P6

Side Cards

SCJ

SCL

SCZ

Specifications

General

CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
Form factor single size Eurocard (board dimensions 100x160mm²)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
Front panel I/O connectors for typical system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
Backplane communication via CompactPCI® Serial connectors
On-board PCIe® mezzanine expansion option for mass storage modules or side cards
Side cards and low profile mass storage modules available as COTS and also as custom specific

Processor

Intel® Atom™ Industrial SoC x6000RE Series (Elkhart Lake)
x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
x6416RE • 4 Cores • 1.7GHz • 9W TDP • 450MHz/16EUs Gfx
x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
x6214RE • 2 Cores • 1.4GHz • 6W TDP • 400MHz/16EUs Gfx
x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx

In-band ECC
Intel® Programmable Services Engine
Intel® Time Coordinate Computing (Intel® TCC) and TSN
Operating life 10 years up to 100% active
T_a -40°C to 85°C

Firmware

Phoenix® UEFI (Unified Extensible Firmware Interface) V2.7 with CSM*
Phoenix® SCT (SecureCore Technology) Release V4.3.0
ACPI tbd
Fully customizable by EKF
Secure Boot and Measured Boot supported
Windows®, Linux and other (RT)OS’ supported

* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS’

Main Memory

Mass Storage

128Mbit SPI Flash (UEFI firmware and customer application data)
SPI Flash 128Mbit (UEFI firmware and customer application data)
Option e•MMC (embedded MMC 5.0 64GByte soldered)
PCIe® based SSD module options via P-HSE1 & P-HSE2 mezzanine connectors
M.2 socket(s) on low profile mezzanine modules (4HP) or side cards (8HP)
Up to 2 x M.2 NVMe SSD size 2280, PCIe x4 (P-HSE1) and PCIe x1 (P-HSE2)
Up to 2 x 1TB as of current
Option custom specific mezzanine mass storage board design on request

Graphics

Networking

Up to 11 Gigabit Ethernet networking interfaces in total
3 x 2500BASE-T RJ45 front ports via SGMII PHYs Marvell® AQR115C
Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module – Marvell® Peridot switch
Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module – 4 x Intel® I210-IT NIC
Option 4 x 2.5GBASE-T backplane w. S83-P6 mezzanine module – 4 x Intel® I226-IT NIC
Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card – 4 x Intel® I225-IT NIC (8HP)
Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM short side card – 4 x Intel® I210-IT NIC (8HP)
Option RJ45 port 1 jack replacement by M12-X connector w. S02-M12 mezzanine (8HP)
TSN Precision time protocol (Time-Sensitive-Networking) as required for OPC UA and OpenAvnu
Enables ultra-reliable low-latency communication (URLLC)
Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness

EHL SoC I/O Usage

3 x USB Type-C front panel connectors (DP Alt Mode)
3 x 2.5GBASE-T SGMII PHYs to RJ45 front ports
4 x PCIe® Gen3 to HSE1 mezzanine connector (configurable 1×4 or 4×1 links)
4 x PCIe® Gen3 to HSE2 mezzanine connector (4×1 links via Gen3 switch)
3 x PCIe® Gen3 to backplane connectors (x1 links, 1 derived from SoC, 2 x via Gen3 switch)
1 x PCIe® Gen3 to 1:7 switch (1 x USB controller, 2 x backplane use, 4 x HSE2 mezzanine)
e•MMC 5.1 (ordering option, mass storage device up to 64GB)
1 x SATA 3.2 for backplane usage
eSPI, Audio, I2C, UART, CAN-FD, Time Sync to mezzanine expansion connector N-EXP
TPM 2.0 module

Additional Building Blocks

Security

Front Panel I/O (4HP)

Front Panel I/O (8HP)

CompactPCI® Serial Backplane Resources

PICMG® CompactPCI® Serial CPU card (system slot controller)
Support for up to three PCIe® based CompactPCI® Serial peripheral boards, Gen3 x1 links
1 x PCIe® derived from EHL SoC, 2 x PCIe® via PI7C9X3G808GP switch
Support for 1 x native SATA (6Gbps)
Option 3 x SATA in addition with JMS562 controller (2 x SATA RAID 0/1)
Support for 1 x USB2/3 (5Gbps) via TUSB7340 controller
Option 8 x Gigabit Ethernet Switch (S80-P6 low profile mezzanine module)
Option 4 x Gigabit Ethernet NICs (S82-P6 low profile mezzanine module)
Option 4 x 2.5Gigabit Ethernet NICs (S83-P6 low profile mezzanine module)

Local Expansion

Mezzanine side card connectors for optional local expansion
HSE1 – High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
HSE2 – High speed expansion connector, PCIe® Gen3 configured 4×1, via PCIe® packet switch
EXP – Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)

4HP Low profile mezzanine module options (to be ordered separately)
S20-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x Type-C USB F/P connector
S40-NVME Mezzanine module – 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P Connector
S42-MC Mezzanine module – 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
S48-SSD Mezzanine Module – 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
S80-P6 Mezzanine module – 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
S82-P6 Mezzanine module – M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
S83-P6 Mezzanine module – M.2 NVMe SSD & 4 x 2.5GbE NIC via P6 backplane connector
Custom specific module design

8HP Mezzanine side card option (to be ordered separately)
SCJ-VEENA Quad RJ45 2.5GbE NIC & M.2 SSD storage
SCL-RHYTHM Quad M12-X GbE NIC & M.2 SSD storage
SCZ-NVM Dual M.2 NVMe SSD, quad UART
S02-M12 – RJ45 port 1 replacement by M12-X connector (top or bottom mount)
Custom specific side card design

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant
Operating temperature -40°C to +85°C (industrial temperature range)
Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
Humidity 5% … 95% RH non Condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 20.6 years (MIL-HDBK-217F, SN29500 @+40°C)
EC Regulatory EN55035, EN55032, EN62368-1 (CE)

RT OS Board Support Packages & Driver

Applications

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

SC8-FLUTE

CompactPCI® Serial CPU Card • Low Power Intel® Atom™ x6000RE SoC (Elkhart Lake)

EKF Elektronik GmbH

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